Henkel LOCTITE Underfill: Industry-leading standard

12/02/2020 - Đăng bởi : Nga Nguyen

Henkel's innovative capillary flow underfills for CSP, BGA, WLCSP, LGA and other similar devices lower stress, improve reliability and offer outstanding processability.

 

HENKEL UNDERFILL 

Henkel’s LOCTITE ECCOBOND and LOCTITE underfills offer the highest levels of reliability with the options of both reworkable and non-reworkable formulations. 

   -  Fast flow speeds, fill effectively bottom-side component spaces.

   -  Formulations designed to decrease stress caused by mismatched expansion coefficients.

   -  Outstanding reliability in thermal cycling, thermal shock, drop testing.

 

To enhance the reliability of many handheld devices, Henkel’s LOCTITE portfolio of underfills offers formulations that quickly fill the space between the package and board, cure fast, offer outstanding protection for solder joints against mechanical strains such as shock, drop and vibration, and allow for reworkability. 

 

For applications where full underfill is not required, LOCTITE cornerbond and edgebond technologies provide a cost-effective solution, with strong perimeter reinforcement and self-centering capability.


Creative Engineering provides you with a list of outstanding underfill LOCTITE products:


OUTSTANDING PRODUCTS


LOCTITE ECCOBOND UF 3808, Epoxy, Underfill

Loctite Underfill 3808 - Creative Engineering


LOCTITE® ECCOBOND UF 3808 capillary underfill is designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.


LOCTITE ECCOBOND UF 3810, Epoxy, Underfill


Loctite Underfill 3810 - Creative Engineering


LOCTITE® ECCOBOND UF 3810 reworkable epoxy underfill is designed for CSP and BGA applications. 

   -  High Tg

   -  Fast cure at moderate temperatures

   -  Halogen free

   -  Compatible with most Pb-free solders

   -  Stable electrical performance in temperature humidity bias

   -  Reworkable

   -  Room temperature flow capability

 

LOCTITE® 3518™ 


LOCTITE® 3518™ is a one part, heat curable epoxy. It is designed as non-reworkable CSP/BGA underfill for protection of solder joint against mechanical stress when used for hand held electronics devices. 


LOCTITE 3549 

LOCTITE 3549 reworkable epoxy underfill is designed to provide protection for solder joints against induced stress, increasing both drop test and temperature cycle performance of the device.


Creative Engineering is the number one distributor of Henkel - Loctite in Vietnam and Asia. Contact us now to further upgrade your business!

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